The EBYTE ECK30 series are industrial-grade embedded core boards based on the Allwinner T113-i processor, featuring a triple-core heterogeneous architecture (Dual Arm Cortex-A7, RISC-V, HiFi4 DSP). The ECK30-T13IC series uses a BTB connector, while the ECK30-T13IA series uses a 140-pin stamp-hole package. Both series offer optional 256MB/512MB/1GB DDR3 RAM and NAND Flash or eMMC storage, providing rich I/O resources. They are ideal for industrial control, HMI, and IoT applications.
| Model | RAM | Storage | Interface | Temp. Range | Power Supply |
| :--- | :--- | :--- | :--- | :--- | :--- |
| ECK30-T13IC1E8-I | 1GB DDR3 | 8GB eMMC | BTB | -40℃ ~ +85℃ | DC +5V ±10% |
| ECK30-T13IC5E8-I | 512MB DDR3 | 8GB eMMC | BTB | -40℃ ~ +85℃ | DC +5V ±10% |
| ECK30-T13IC2N2-I | 256MB DDR3 | 256MB NAND | BTB | -40℃ ~ +85℃ | DC +5V ±10% |
| ECK30-T13IA1GE8G-I | 1GB DDR3 | 8GB eMMC | 140-pin Stamp Hole | -40℃ ~ +85℃ | DC +5V ±10% |
| ECK30-T13IA5ME8G-I | 512MB DDR3 | 8GB eMMC | 140-pin Stamp Hole | -40℃ ~ +85℃ | DC +5V ±10% |
| ECK30-T13IA2MN2M-I | 256MB DDR3 | 256MB NAND | 140-pin Stamp Hole | -40℃ ~ +85℃ | DC +5V ±10% |
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