The EBYTE ECK31-T13SA series are industrial-grade embedded core boards based on the Allwinner T113-S processor, featuring a triple-core heterogeneous architecture (Dual Arm Cortex-A7, RISC-V, HiFi4 DSP) with built-in SIP DDR3 memory. All models adopt a compact 35×29×3mm stamp-hole package with 116 pins, integrating Gigabit Ethernet PHY and power management. The series offers 128MB or 256MB DDR3 RAM, paired with either 256MB NAND Flash or 8GB eMMC storage, covering cost-effective to high-capacity application needs for industrial control, HMI, and IoT scenarios
| Model | Processor | RAM | Storage | Interface | Temp. Range | Size (mm) | Ethernet | Power Supply |
| :--- | :--- | :--- | :--- | :--- | :--- | :--- | :--- | :--- |
| ECK31-T13SA2ME8G | T113-S4 (T113M4020DC0) | 256MB DDR3 | 8GB eMMC | 116-pin Stamp Hole | -25℃ ~ +85℃ | 35×29×3 | 1× GbE (PHY on board) | DC +5V ±10% |
| ECK31-T13SA2MN2M | T113-S4 (T113M4020DC0) | 256MB DDR3 | 256MB NAND | 116-pin Stamp Hole | -25℃ ~ +85℃ | 35×29×3 | 1× GbE (PHY on board) | DC +5V ±10% |
| ECK31-T13SA1ME8G | T113-S3 | 128MB DDR3 | 8GB eMMC | 116-pin Stamp Hole | -25℃ ~ +85℃ | 35×29×3 | 1× GbE (PHY on board) | DC +5V ±10% |
| ECK31-T13SA1MN2M | T113-S3 | 128MB DDR3 | 256MB NAND | 116-pin Stamp Hole | -25℃ ~ +85℃ | 35×29×3 | 1× GbE (PHY on board) | DC +5V ±10% |
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